The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Nov. 21, 2018
Applicant:

The Texas A&m University System, College Station, TX (US);

Inventors:

Charles Brandon Sweeney, College Station, TX (US);

Micah J. Green, College Station, TX (US);

Assignee:

The Texas A&M University System, College Station, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); B29C 35/08 (2006.01); C09J 11/04 (2006.01); F16B 5/08 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B29K 63/00 (2006.01); B29K 75/00 (2006.01); B29K 105/00 (2006.01); B29K 105/16 (2006.01); B29K 301/10 (2006.01); B29K 307/04 (2006.01); B29K 507/04 (2006.01); B29K 509/00 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); B29C 35/0805 (2013.01); C09J 11/04 (2013.01); F16B 5/08 (2013.01); B29C 2035/0811 (2013.01); B29C 65/4835 (2013.01); B29C 66/91651 (2013.01); B29K 2063/00 (2013.01); B29K 2075/00 (2013.01); B29K 2105/002 (2013.01); B29K 2105/0088 (2013.01); B29K 2105/162 (2013.01); B29K 2301/10 (2013.01); B29K 2307/04 (2013.01); B29K 2507/04 (2013.01); B29K 2509/00 (2013.01); C08K 3/041 (2017.05); C08K 3/042 (2017.05); C09J 2301/416 (2020.08); C09J 2463/00 (2013.01); C09J 2475/00 (2013.01);
Abstract

A non-contact method of joining two components via direct heating of a thermoset adhesive includes applying the thermoset adhesive to at least a first component of the two components. The thermoset adhesive includes a susceptor to reacts in the presence of an electromagnetic field. The method includes placing the first component and a second component of the two components in proximity to an electromagnetic field. In some aspects, the method includes placing the first and second components in proximity to an electromagnetic field of a capacitor. The susceptor interacts with the electromagnetic field to heat the thermoset adhesive via resistive heating. In some aspects, a method of direct-contact heating of the thermoset adhesive includes attaching electrodes to a film comprising the adhesive. The components being joined together are not directly heated by the electromagnetic field, and as a result experience much lower temperatures than the thermoset adhesive.


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