The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Oct. 15, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Joseph Michael Dennis, Chicago, IL (US);

Andy Theodora Tek, San Jose, CA (US);

Robert David Allen, Golden, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08G 59/20 (2006.01); C08G 59/50 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 3/40 (2006.01); C08K 5/13 (2006.01); C08K 5/1515 (2006.01); C09J 7/35 (2018.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/20 (2013.01); C08G 59/50 (2013.01); C08K 3/041 (2017.05); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 3/40 (2013.01); C08K 5/13 (2013.01); C08K 5/1515 (2013.01); C09J 7/35 (2018.01); C08K 2003/0806 (2013.01); C08K 2003/2227 (2013.01); C09J 2203/326 (2013.01); C09J 2301/502 (2020.08); C09J 2463/00 (2013.01);
Abstract

A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200° C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200° C.


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