The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jul. 06, 2021
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Eric Thomas Martin, Corvallis, OR (US);

James Michael Gardner, Corvallis, OR (US);

Rogelio Cicili, Corvallis, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); G11C 5/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04548 (2013.01); G11C 5/147 (2013.01);
Abstract

An integrated circuit includes a plurality of fluid actuation devices, a plurality of memory cells, a high-voltage high-power supply node, and a high-voltage low-power supply node. The high-voltage high-power supply node is to supply a first voltage and a first maximum current to the plurality of fluid actuation devices. The high-voltage low-power supply node is to supply a second voltage and a second maximum current to the plurality of memory cells.


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Martin, Eric. (2025). Integrated circuits including high-voltage high-power and high-voltage low-power supply nodes (U.S. Patent No. 12311661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12311661

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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