The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Feb. 24, 2022
Applicant:
Zeon Corporation, Tokyo, JP;
Inventor:
Kunihito Arai, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/02 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4895 (2013.01); B29C 65/02 (2013.01);
Abstract
Disclosed is a method of joining resin members that includes: forming a coating layer by applying a solvent to a surface of a resin member, the solvent allowing the thermoplastic resin to have a degree of swelling of 1.05 or more and 3.00 or less when the thermoplastic resin is swollen by the solvent, and having a boiling point B° C. of R ° C. or lower where R ° C. is a glass transition temperature of the thermoplastic resin; laminating resin members one another via the coating layer to form a laminate; and pressing the laminate in the lamination direction while heating at a heating temperature H ° C. that is equal to or lower than R ° C.