The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Dec. 08, 2020
Kyoraku Co., Ltd., Kyoto, JP;
Yuki Harasawa, Yamato, JP;
Takeshi Kato, Kakamigahara, JP;
Tsutomu Ouchi, Tsuchiura, JP;
Tatsuya Fukuda, Kakamigahara, JP;
Yosuke Hayashi, Yamato, JP;
Takafumi Funato, Yamato, JP;
Seiji Ono, Yamato, JP;
KYORAKU CO., LTD., Kyoto, JP;
Abstract
A molding system capable of reducing molding defects including first and second parison forming devices; first and second molds configured to be opened and closed; and a control unit. The first parison forming device comprises a first extruder, a first accumulator, and a first injection head, the first parison forming device is configured to form a first parison by injecting a first molten resin from the first injection head after the first molten resin extruded from the first extruder is accumulated in the first accumulator, the second parison forming device comprises a second extruder, a second accumulator, and a second injection head, the second parison forming device is configured to form a second parison by injecting a second molten resin from the second injection head after the second molten resin extruded from the second extruder is accumulated in the second accumulator.