The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

May. 26, 2022
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kosuke Atsuta, Shiojiri, JP;

Hiroki Minowa, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01);
U.S. Cl.
CPC ...
B29C 45/768 (2013.01); B29C 45/766 (2013.01); B29C 2045/7606 (2013.01); B29C 2945/76163 (2013.01); B29C 2945/76946 (2013.01); B29C 2945/76949 (2013.01);
Abstract

A molding machine management device that is able to couple to a molding machine includes a storage unit configured to store, in chronological order, numerical value information on a molding process when a molded product is molded by the molding machine and four-factor information on four factors of production which includes a man, a machine, a material, and a method when the molded product is produced, and an output control unit configured to classify the numerical value information into a plurality of groups for periods divided according to time when the four factors of production changes, and output the numerical value information classified into the plurality of groups to an output unit in group units.


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Atsuta, Kosuke. (2025). Molding machine management device (U.S. Patent No. 12311590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12311590

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