The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Apr. 28, 2022
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Masahide Ebisui, Osaka, JP;

Yasuhiro Iwata, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 44/34 (2006.01); B29C 44/44 (2006.01); B29K 101/12 (2006.01); B29K 105/04 (2006.01); C08J 9/18 (2006.01);
U.S. Cl.
CPC ...
B29C 44/3461 (2013.01); B29C 44/3426 (2013.01); B29C 44/445 (2013.01); C08J 9/18 (2013.01); B29K 2101/12 (2013.01); B29K 2105/048 (2013.01); B29K 2995/0041 (2013.01); C08J 2201/0502 (2013.01); C08J 2300/22 (2013.01);
Abstract

A method for producing expanded particles having a high expansion ratio by a pressure-release expansion with a simpler configuration and at a low facility cost is provided. A production device includes an expansion cylinder being provided with a connecting port that connects with open-system branch cylinder and having a space of a saturated steam atmosphere. The space of a saturated steam atmosphere may be a different space from a space inside the branch cylinder. A temperature (T) inside the expansion chamber exceeds 102° C. and is not higher than a higher one of 108° C. and a temperature obtained by a melting point Tm of a thermoplastic resin minus 14° C. A temperature (T) at a connecting port is not lower than 100° C., and the temperature (T) is higher than the temperature (T).


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