The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jun. 02, 2023
Applicant:

Qingdao University of Technology, Shandong, CN;

Inventors:

Sen Liang, Shandong, CN;

Fengquan Wang, Shandong, CN;

Cheng Tian, Shandong, CN;

Long Wu, Shandong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 15/12 (2006.01); B29C 70/44 (2006.01); B29K 33/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29B 15/125 (2013.01); B29C 70/443 (2013.01); B29K 2033/12 (2013.01); B29K 2307/04 (2013.01);
Abstract

A method with which mechanical properties of the interface of the fiber reinforced thermoplastic resin matrix composite material can be improved by conducting grafting on surfaces of materials. A carbon fiber (CF) and a polymethyl methacrylate resin (PMMA) are subjected to interface modification treatment to introduce active carboxyl groups to the surfaces of the materials. Then, hexamethylene diisocyanate (HDI) is used as a coupling layer for connecting the carboxyl groups on the surfaces of the carbon fiber and on the surfaces of the polymethyl methacrylate resin to form a 'molecular bridge'. Accordingly, the interface binding force between the resin and the fiber is improved by chemical grafting. A modified carbon fiber reinforced polymethyl methacrylate composite material sample (CF/PMMA) is prepared by a thin film lamination method, and the composite material sample prepared is subjected to a microscopic verification testing of the validity of the method provided in the present disclosure.


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