The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Mar. 25, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Yasutoshi Hideshima, Matsumoto, JP;
Setsuya Iwashita, Nirasaki, JP;
Fumiya Maeda, Azumino, JP;
Shunsuke Uchizono, Shiojiri, JP;
Koichi Ozaki, Okayama, JP;
Tadao Fukuta, Kurashiki, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/16 (2022.01); B22D 17/00 (2006.01); B22D 23/06 (2006.01); B22F 1/05 (2022.01); B22F 1/068 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/12 (2022.01); B22F 1/14 (2022.01); B22F 3/22 (2006.01); B22F 8/00 (2006.01); B32B 1/00 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/16 (2006.01); C22C 1/10 (2023.01); C22C 32/00 (2006.01); B22F 3/00 (2021.01); C22C 1/05 (2023.01);
U.S. Cl.
CPC ...
B22F 1/16 (2022.01); B22D 17/007 (2013.01); B22D 23/06 (2013.01); B22F 1/05 (2022.01); B22F 1/068 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/12 (2022.01); B22F 1/14 (2022.01); B22F 3/225 (2013.01); B22F 8/00 (2013.01); B32B 1/00 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); B32B 15/16 (2013.01); C22C 1/1084 (2013.01); C22C 32/0084 (2013.01); B22F 3/003 (2013.01); B22F 2301/058 (2013.01); B22F 2302/40 (2013.01); B22F 2998/10 (2013.01); C22C 1/05 (2013.01); Y10T 428/12181 (2015.01); Y10T 428/12229 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12625 (2015.01); Y10T 428/12729 (2015.01); Y10T 428/29 (2015.01); Y10T 428/2918 (2015.01); Y10T 428/2927 (2015.01); Y10T 428/2933 (2015.01); Y10T 428/2938 (2015.01); Y10T 428/2947 (2015.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01); Y10T 428/2998 (2015.01);
Abstract
Provided is a thixomolding material including a metal body that contains Mg as a main component, and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.