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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12311437 B1

PDFFull Text
Date of Patent:
May. 27, 2025

Filed:

Mar. 25, 2022

Thixomolding material

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yasutoshi Hideshima, Matsumoto, JP;

Setsuya Iwashita, Nirasaki, JP;

Fumiya Maeda, Azumino, JP;

Shunsuke Uchizono, Shiojiri, JP;

Koichi Ozaki, Okayama, JP;

Tadao Fukuta, Kurashiki, JP;

Assignee:

SEIKO EPSON CORPORATION, Tokyo, JP;

Attorney:

CHIP LAW GROUP

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
B22F 1/16 (2022.01); B22D 17/00 (2006.01); B22D 23/06 (2006.01); B22F 1/05 (2022.01); B22F 1/068 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/12 (2022.01); B22F 1/14 (2022.01); B22F 3/22 (2006.01); B22F 8/00 (2006.01); B32B 1/00 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/16 (2006.01); C22C 1/10 (2023.01); C22C 32/00 (2006.01); B22F 3/00 (2021.01); C22C 1/05 (2023.01);
U.S. Cl.
CPC ...
B22F 1/16 (2022.01); B22D 17/007 (2013.01); B22D 23/06 (2013.01); B22F 1/05 (2022.01); B22F 1/068 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/12 (2022.01); B22F 1/14 (2022.01); B22F 3/225 (2013.01); B22F 8/00 (2013.01); B32B 1/00 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); B32B 15/16 (2013.01); C22C 1/1084 (2013.01); C22C 32/0084 (2013.01); B22F 3/003 (2013.01); B22F 2301/058 (2013.01); B22F 2302/40 (2013.01); B22F 2998/10 (2013.01); C22C 1/05 (2013.01); Y10T 428/12181 (2015.01); Y10T 428/12229 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12625 (2015.01); Y10T 428/12729 (2015.01); Y10T 428/29 (2015.01); Y10T 428/2918 (2015.01); Y10T 428/2927 (2015.01); Y10T 428/2933 (2015.01); Y10T 428/2938 (2015.01); Y10T 428/2947 (2015.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01); Y10T 428/2998 (2015.01);
Abstract

Provided is a thixomolding material including a metal body that contains Mg as a main component, and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.

Find Patent Forward Citations

Hideshima, Yasutoshi. (2025). Thixomolding material (U.S. Patent No. 12311437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12311437

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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