The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Mar. 20, 2024
Applicant:

Ansell Limited, Richmond, AU;

Inventors:
Assignee:

Ansell Limited, Richmond, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A41D 31/02 (2019.01); A41D 19/00 (2006.01); B29C 41/14 (2006.01); B29C 41/22 (2006.01); B29K 7/00 (2006.01); B29K 9/00 (2006.01); B29L 31/48 (2006.01); C08J 5/02 (2006.01); C08L 9/02 (2006.01); C08L 19/00 (2006.01);
U.S. Cl.
CPC ...
A41D 31/02 (2013.01); A41D 19/0058 (2013.01); C08J 5/02 (2013.01); C08L 9/02 (2013.01); C08L 19/00 (2013.01); A41D 2600/20 (2013.01); B29C 41/14 (2013.01); B29C 41/22 (2013.01); B29K 2007/00 (2013.01); B29K 2009/00 (2013.01); B29K 2995/0058 (2013.01); B29L 2031/4864 (2013.01); C08J 2309/02 (2013.01); C08J 2319/00 (2013.01); C08J 2333/08 (2013.01); C08J 2409/02 (2013.01); C08J 2419/00 (2013.01); C08J 2433/08 (2013.01); C08L 2203/02 (2013.01);
Abstract

A thin organic solvent resistant glove is disclosed including: a first polymeric layer in a shape of a glove including at least one of a blend of a polyisobutylene material and a nitrile-butadiene material, or a nitrile-butadiene material; a second polymeric layer in a shape of a glove including at least one of a polyisobutylene material or a blend of a polyisobutylene material and a nitrile-butadiene material, disposed on the first polymeric layer, and a third polymeric layer in a shape of a glove including a nitrile-butadiene material or an acrylic polymer material disposed on the second polymeric layer.


Find Patent Forward Citations

Loading…