The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Mar. 30, 2022
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;

Inventors:

Kouji Takami, Kyoto, JP;

Kenji Kamino, Kyoto, JP;

Masahiro Watanabe, Kyoto, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); H05K 1/0216 (2013.01); H05K 9/0083 (2013.01);
Abstract

An electromagnetic wave shielding film includes: a protective layer; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer. Conductive bumps are formed on a side of the adhesive layer of the shield layer. The conductive bumps are positioned on a tessellation of one kind of polygon at vertices of respective polygons, and the conductive bumps are arranged such that, with respect to each of the conductive bumps, when drawing line segments connecting respective conductive bumps and nearest conductive bumps at a nearest position and drawing a straight line passing through one line segment among the drawn line segments, the straight line has a portion that does not overlap with the other line segments.


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