The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Feb. 22, 2023
Therlect Co., Ltd., New Taipei, TW;
Chien-Yu Chen, New Taipei, TW;
THERLECT CO., LTD., New Taipei, TW;
Abstract
The present disclosure provides a method for manufacturing a heat dissipating plate. The method comprises the steps of providing a first substrate having a through hole and a second substrate having a first region and a second region defined thereon; disposing a capillary structure layer on the first region; disposing a plurality of support structures on the second region; disposing a sealing glue layer on the second substrate surrounding the first region and the second region; attaching the first substrate to the second substrate through the sealing glue layer so that the first substrate is positioned over the second substrate to form a cavity; injecting a heat dissipating liquid into the cavity through the through hole; heating the first substrate or the second substrate for a predetermined time duration to drive a part of air in the cavity from the cavity through the through hole; and sealing the through hole to convert the cavity into a non-vacuum sealed cavity.