The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Dec. 08, 2022
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Kanji Shimoosako, Otsu, JP;

Kentaro Tsukuya, Otsu, JP;

Hitoshi Yasuhira, Otsu, JP;

Konoshin Fujimoto, Otsu, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01);
Abstract

The laminate includes a multilayer polyimide film having thermoplastic polyimide layers on both sides of a core layer which is a non-thermoplastic polyimide film and a surface layer contacting the thermoplastic polyimide layer on one surface-side of the multilayer polyimide film. The surface layer may be an inorganic layer having a thickness of 1 to 200 nm or a resin layer having a thickness of 0.1 to 5 μm. A single-sided metal-clad laminate is formed by laminating a metal layer on the thermoplastic resin layer on the surface layer non-formed surface of the laminate.


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