The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

May. 16, 2023
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Taichi Misawa, Osaka, JP;

Keiji Tanaka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H05K 1/028 (2013.01); H05K 3/103 (2013.01); H05K 3/4626 (2013.01); H05K 2201/095 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A package for an optical module includes a substrate that includes a first wiring layer, a second wiring layer, and a third wiring layer. The package includes a first insulating layer between the first wiring layer and the second wiring layer, the first insulating layer including first vias. The package includes a second insulating layer between the second wiring layer and the third wiring layer, the second insulating layer including second vias and third vias. Each first vias is provided between a corresponding second via and a corresponding third via. The first vias are arranged at a first interval along a first direction. The second vias are arranged at a second interval along the first direction. Each second vias is disposed at an offset by half of the second interval from the corresponding third via.


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