The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Apr. 06, 2022
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Wilfred Ryan Vidamo Habana, Singapore, SG;
Hidekazu Nakanishi, Sakai, JP;
XiaoJun Chew, Singapore, SG;
Mitsuhiro Furukawa, Nishinomiya, JP;
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H03H 9/10 (2006.01); H03H 9/54 (2006.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H03H 9/105 (2013.01); H03H 9/54 (2013.01);
Abstract
A method for manufacturing a packaged acoustic wave component includes forming or providing a cap substrate, forming a metal layer on a surface of the cap substrate, marking the metal layer with one or more indicia and bonding the cap substrate to a device substrate that has an acoustic wave device on a surface thereof. The metal layer is paced from and faces the acoustic wave device.