The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Oct. 22, 2024
Applicant:

Nuvoton Technology Corporation Japan, Kyoto, JP;

Inventors:

Takeshi Imamura, Kyoto, JP;

Masaaki Hirako, Shiga, JP;

Takashi Ohashi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H10D 30/66 (2025.01); H10D 64/23 (2025.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H10D 30/668 (2025.01); H10D 62/117 (2025.01); H10D 62/126 (2025.01); H10D 64/252 (2025.01); H01L 2224/2919 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32137 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer in contact with and connected to an entire back face of the semiconductor layer; and a support bonded to the back face side of the metal layer via a conductive adhesive. In a plan view, the support is larger in area than the semiconductor layer and encompasses the semiconductor layer. A thickness of the support is greater than a thickness of the semiconductor layer. In a cross-sectional view of the semiconductor device including a center of the semiconductor layer and an outer periphery of the semiconductor layer in the plan view, a semiconductor chip resulting from excluding the support and the conductive adhesive from the semiconductor device is in a curved shape projecting in a direction away from the support.


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