The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Dec. 29, 2022
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventors:
Myong Soo Oh, Yongin-si, KR;
Doo San Park, Yongin-si, KR;
Hyun Chul Jin, Yongin-si, KR;
Hee Jong Shin, Yongin-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/86 (2013.01); H01L 24/79 (2013.01); H05K 1/181 (2013.01); H05K 2201/10128 (2013.01);
Abstract
A bonding apparatus includes: an anisotropic conductive film ('ACF') attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.