The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Dec. 06, 2021
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Kai-Po Shang, Taoyuan, TW;

Jui-Hsiu Jao, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H10B 20/20 (2023.01); H10B 20/25 (2023.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5252 (2013.01); H01L 23/5256 (2013.01); H10B 20/20 (2023.02); H10B 20/25 (2023.02); H10D 64/513 (2025.01);
Abstract

A fuse component and a semiconductor device and a semiconductor device having the fuse component are provided. The fuse component includes an active region having a surface, a first fuse dielectric layer extending from the surface of the active region into the active region, a first gate metal layer surrounded by the first fuse dielectric layer, a second fuse dielectric layer extending from the surface of the active region into the active region, and a second gate metal layer surrounded by the second fuse dielectric layer. The first gate metal layer is electrically connected with the second gate metal layer.


Find Patent Forward Citations

Loading…