The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Feb. 10, 2023
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Kiyohiro Uchida, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/67121 (2013.01); H01L 23/367 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 2224/753 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/8384 (2013.01);
Abstract
A structural body is partially surrounded by a positioning plate, and a semiconductor element, a joining member, and a base plate around the joining member are exposed from the positioning plate, so that a positional relationship between the semiconductor element and the base plate is maintained. The joining member is heated by a heater while the semiconductor element, joining member, and base plate exposed from the positioning plate are isotropically pressurized by a piston via a medium and a bag member.