The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Sep. 27, 2019
Applicants:

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Man-Zhi Peng, Huaian, CN;

Rui-Wu Liu, Huaian, CN;

Si Xiong, Shenzhen, CN;

Lin-Jie Gao, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/43 (2013.01); H01L 2224/43125 (2013.01);
Abstract

An interposer, which is used to connect two circuit boards, includes an inner structure (), an outer structure (), and a protective layer (). The inner structure () includes a first base layer () and a first wiring layer () formed on the first base layer (). The outer structure () includes a second base layer () and a second wiring layer () formed on the second base layer (). An end portion of at least wiring line of the first wiring layer () and the second wiring layer () extends to a sidewall of the interposer (). An end of another wiring line extends to the other sidewall of the interposer (). The first wiring layer () is electrically connected to the second wiring layer () by a conductive blind hole ().


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