The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Mar. 02, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Youngki Chang, Santa Clara, CA (US);

Muhannad Mustafa, Milpitas, CA (US);

Kartik Shah, Saratoga, CA (US);

Dhritiman Subha Kashyap, Bangalore, IN;

Dhivanraj Subramanian, Tamil Nadu, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/20 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32715 (2013.01); H01J 37/32651 (2013.01);
Abstract

Processing chambers, substrate supports and thermal shields are described. A thermal shield comprises a disc-shaped body having a thickness, an outer diameter with a first edge and a second edge at opposite ends of a diameter of the disc-shaped body, a front surface and a back surface defining the thickness. The front surface has a first longitudinal region comprising the first edge and a second longitudinal region comprising the second edge. Coating one or more of the first longitudinal region or the second longitudinal region with an emissivity material (i.e., emissivity) reduces side to side temperature variation. In some embodiments, processing chambers having the thermal shield described herein consume less power than comparative processing chambers that do not include a thermal shield.


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