The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Jul. 12, 2023
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Mikio Tahara, Tokyo, JP;

Tomoaki Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C04B 35/4682 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01);
Abstract

A multilayer ceramic electronic device includes a multilayer chip and external electrodes opposite to each other in a second direction orthogonal to a first direction in which internal electrode layers face and include a ceramic grain. 0.722×ln(W×T/E)−5.75+(α−α)+(t/12)≤6.02 is satisfied, when a dimension of the multilayer chip in the first direction is T (μm), a dimension of the multilayer chip in a third direction orthogonal to the first direction and the second direction is W (μm), a number of the internal electrode layers is E, a thermal expansion coefficient of the external electrodes is α(×10/K), a thermal expansion coefficient of the multilayer chip is α(×10/K), and a maximum value of a thickness of the external electrodes on a main face in the first direction is t (μm).


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