The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Oct. 06, 2021
Applicant:
Modular Power Technology, Inc., Sunnyvale, CA (US);
Inventors:
Dhammika L. Perera, San Jose, CA (US);
John Weld, Ledgewood, NJ (US);
Matthew Wilkowski, Rockwall, TX (US);
Assignee:
MODULAR POWER TECHNOLOGY, INC., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/22 (2006.01); H01F 1/147 (2006.01); H01F 1/34 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H02M 1/00 (2006.01); H05K 7/12 (2006.01); H05K 7/20 (2006.01); H10D 89/60 (2025.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 1/147 (2013.01); H01F 1/344 (2013.01); H01F 27/24 (2013.01); H01F 27/2876 (2013.01); H02M 1/0003 (2021.05); H05K 7/12 (2013.01); H05K 7/209 (2013.01); H10D 89/60 (2025.01); H05K 2201/1003 (2013.01);
Abstract
Embodiments of the present disclose a power module system including a power module operatively coupled to an integrated circuit die, where the power module includes a band comprising of a high thermally conductive material disposed around an inductor and where the band is at least partially disposed around the inductor.
Perera, Dhammika. (2025). Apparatus for power module and heat dissipation of an integrated circuit (U.S. Patent No. 12308154). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12308154
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile