The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Mar. 14, 2022
Applicant:

Netlist, Inc., Irvine, CA (US);

Inventor:

Hyun Lee, Ladera Ranch, CA (US);

Assignee:

Netlist, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 7/10 (2006.01); G11C 7/12 (2006.01);
U.S. Cl.
CPC ...
G11C 5/066 (2013.01); G11C 5/06 (2013.01); G11C 7/1057 (2013.01); G11C 7/1084 (2013.01); G11C 7/12 (2013.01);
Abstract

A DRAM packages comprises stacked array dies including at least a first array die and a stacked over at least the first array die, data terminals, via which the DRAM package receives or outputs data signals, first data interconnects between respective ones of the data terminals and the first array die, and second data interconnects distinct from the first data interconnects and between respective ones of the data terminals and the second array die. The DRAM package further comprises drivers configured to drive first data signals to the first array die via the first data interconnects and second data signals to the second array die via the second data interconnects. A first data signal is driven by one or more drivers having a first driver size, and a second data signal is driven by one or more drivers having a second driver size different from the first driver size.


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