Laser packaging system and intelligent heat dissipation method thereof

Abstract

The present disclosure provides a laser packaging system and an intelligent heat dissipation method thereof. The system includes: a laser array module having a plurality of lasers arranged at intervals, each laser having a heat sink, and the heat sink being provided with a TEC semiconductor refrigerator; a training module configured to train and verify a deep learning model based on a measured temperature of the laser and historical operating state data within a specific time period so as to output the trained deep learning model; a prediction module configured to input a first parameter and a second parameter of the detected laser into the trained deep learning model to generate a predicted temperature, wherein the first parameter includes power, and the second parameter includes running time; and a temperature adjusting module configured to control the TEC semiconductor refrigerator to adjust temperature of the laser based on the predicted temperature.