The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Aug. 23, 2022
Applicant:

Shanghai Huali Microelectronics Corporation, Shanghai, CN;

Inventors:

Yu Zhang, Shanghai, CN;

Xiaobin Zhu, Shanghai, CN;

Xiaolong Wang, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/00 (2006.01); H01L 27/146 (2006.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 7/70475 (2013.01); H10F 39/011 (2025.01);
Abstract

The present application discloses a method for measuring stitching overlay accuracy of image sensor stitching manufacturing, forming an A-type overlay pattern mark and a corresponding B-type overlay pattern mark on the edge of each rectangular pixel area to be stitched; after the A-type overlay pattern mark and the B-type overlay pattern mark are stitched and exposed, performing metrology by means of a scanning electron microscope to obtain dimension features; and according to the dimension features of the A-type overlay pattern mark and the B-type overlay pattern mark stitched together and exposed and measured by the scanning electron microscope, determining stitching overlay accuracy of two adjacent rectangular pixel areas. The present application can achieve direct metrology on the overlay pattern mark on the stitched pixel area of a product, facilitating timely and accurate monitoring on the stitching overlay accuracy of image sensor stitching manufacturing.


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