Lithography and method of fabricating semiconductor device using the same

Abstract

A method includes grouping, in a first layout, pattern regions which have duplicate layout patterns including weak regions as a group, calculating defect probabilities of the pattern regions, respectively, calculating a defect frequency and a defect rate of the group based on the defect probabilities of the pattern regions, predicting a degree of defects of a second layout of the pattern regions, based on the defect frequency and the defect rate, and performing an extreme ultraviolet (EUV) lithography process on a substrate, based on the second layout. The defect probabilities are calculated by performing an optical proximity correction (OPC) simulation on the pattern region, calculating a stochastic variation of a linewidth of a simulation pattern in the weak region as a Gaussian distribution, and defining a threshold linewidth, which is used as a reference of the random defect, in the Gaussian distribution.