The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Jul. 15, 2020
Applicant:

Ningbo Crrc Times Transducer Technology Co., Ltd., Ningbo, CN;

Inventors:

Xiaowei Hou, Ningbo, CN;

Yang Lv, Ningbo, CN;

Liangguang Zheng, Ningbo, CN;

Juping Li, Ningbo, CN;

Po Zhang, Ningbo, CN;

Peng Wu, Ningbo, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); G01R 33/04 (2006.01); G01R 33/3873 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0052 (2013.01); G01R 33/04 (2013.01); G01R 33/3873 (2013.01);
Abstract

A manufacturing method for a fluxgate chip, comprising: firstly, selecting two high-resistance silicon wafers, electroplating a ferromagnetic core on the surface of one of the two high-resistance silicon wafers, and providing a ferromagnetic core cavity on the surface of the other high-resistance silicon wafer; then, bonding the two high-resistance silicon wafers up and down; next, respectively providing coil grooves, through grooves and electrode windows on the surfaces of opposite sides of the two high-resistance silicon wafers to form a silicon wafer mold; and finally, filling the surface of the silicon wafer mold with alloy. By means of electroplating, post-bonding and final etching, on the one hand, the formed fluxgate chip has both small thickness and sufficient strength, on the other hand, large-scale batch production of the fluxgate chip can be achieved, the working efficiency is improved, and the production cost is reduced.


Find Patent Forward Citations

Loading…