The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Nov. 28, 2023
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Michael K. McCord, San Francisco, CA (US);

Stacy H. Mo, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/04 (2006.01); G01R 31/26 (2020.01); G02B 5/02 (2006.01);
U.S. Cl.
CPC ...
G01N 27/041 (2013.01); G01N 27/045 (2013.01); G01R 31/2635 (2013.01); G02B 5/02 (2013.01);
Abstract

Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.


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