The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jan. 18, 2023
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Chiu-Yen Chiu, Hsinchu County, TW;
Li-Ju Chen, Hsinchu, TW;
Sheng-Hui Wu, Hsinchu, TW;
Chia-Chen Fang, Taipei, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/06 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); C23C 2/06 (2006.01); C23C 2/08 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C25D 1/04 (2006.01); C25D 3/22 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 5/00 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/48 (2006.01); C25D 5/50 (2006.01); H01M 4/00 (2006.01); H01M 4/13 (2010.01); H01M 4/134 (2010.01); H01M 4/139 (2010.01); H01M 4/66 (2006.01);
U.S. Cl.
CPC ...
C25D 7/0614 (2013.01); B32B 15/01 (2013.01); B32B 15/013 (2013.01); B32B 15/018 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C23C 2/06 (2013.01); C23C 2/08 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 28/028 (2013.01); C23C 28/32 (2013.01); C23C 28/325 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 1/04 (2013.01); C25D 3/22 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/48 (2013.01); C25D 5/50 (2013.01); C25D 5/605 (2020.08); H01M 4/00 (2013.01); H01M 4/13 (2013.01); H01M 4/134 (2013.01); H01M 4/139 (2013.01); H01M 4/661 (2013.01); H01M 4/667 (2013.01); Y02E 60/10 (2013.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01); Y10T 428/12458 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12819 (2015.01); Y10T 428/12826 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01);
Abstract
A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.