The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Nov. 06, 2020
Applicant:
Oerlikon Surface Solutions Ag, Pfäffikon, Pfäffikon, CH;
Inventors:
Mathias Maier, Owingen, DE;
Othmar Zueger, Triesen, LI;
Assignee:
Oerlikon Surface Solutions AG, Pfäffikon, Pfäffikon, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/02 (2006.01); C23C 14/00 (2006.01); C23C 14/14 (2006.01); C23C 16/00 (2006.01); C23C 16/30 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0015 (2013.01); C23C 14/025 (2013.01); C23C 14/14 (2013.01); C23C 16/006 (2013.01); C23C 16/30 (2013.01); C23C 28/321 (2013.01);
Abstract
A method of forming a coating for deposition to non-metallic surfaces comprises the steps of applying () a semiconductor material to a substrate to form a semiconductor material layer and simultaneously or subsequently applying () metallic material or additional semiconductor material. The metallic material or additional semiconductor material is introduced into the semiconductor material layer in a targeted manner to tailor the optical properties of the coating.