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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12305036 B1

PDFFull Text
Date of Patent:
May. 20, 2025

Filed:

Jun. 26, 2020

Epoxy resin composition for semiconductor encapsulation and semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Shoichi Osada, Annaka, JP;

Hiroki Oishi, Tokyo, JP;

Norifumi Kawamura, Annaka, JP;

Kenji Hagiwara, Annaka, JP;

Ryuhei Yokota, Annaka, JP;

Masahiro Kaneta, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Vickey Nerangis

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08K 5/21 (2006.01); H01L 21/02 (2006.01); C08K 3/013 (2018.01); C08K 3/22 (2006.01); C08K 5/05 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); H01L 21/02104 (2013.01); C08K 3/013 (2018.01); C08K 2003/2217 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2262 (2013.01); C08K 2003/2265 (2013.01); C08K 2003/2289 (2013.01); C08K 2003/2293 (2013.01); C08K 2003/2296 (2013.01); C08K 5/05 (2013.01); C08K 5/21 (2013.01); C08L 2203/206 (2013.01);
Abstract

Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains:

Find Patent Forward Citations

Osada, Shoichi. (2025). Epoxy resin composition for semiconductor encapsulation and semiconductor device (U.S. Patent No. 12305036). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12305036

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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