The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Mar. 16, 2021
Applicant:
Korea Institute of Science and Technology, Seoul, KR;
Inventors:
Assignee:
Korea Institute of Science and Technology, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 70/10 (2020.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C08K 5/09 (2006.01); C08K 7/06 (2006.01); C08K 9/04 (2006.01); C08L 101/12 (2006.01); B22F 1/054 (2022.01); B33Y 80/00 (2015.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
C08L 101/12 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); C08K 3/041 (2017.05); C08K 3/042 (2017.05); C08K 3/046 (2017.05); C08K 3/08 (2013.01); C08K 5/09 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); B22F 1/0547 (2022.01); B33Y 80/00 (2014.12); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); C08K 2201/011 (2013.01); C08L 2203/20 (2013.01);
Abstract
Provided are a conductive composite resin composition for photocurable 3D printing and a preparation method thereof. The conductive composite resin composition for photocurable three-dimensional (3D) printing includes 10 to 90 wt % of a photoreactive viscosity decreasing agent and 10 to 90 wt % of a photocurable resin based on 100 wt % of the conductive composite resin composition, wherein the conductive composite resin composition further comprises 0.01 to 1 wt % of conductive nanostructures, and the conductive composite resin composition has a viscosity of 400 cP or less at a shear rate of 58 s.