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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12305005 B1

PDFFull Text
Date of Patent:
May. 20, 2025

Filed:

May. 31, 2018

Resin composition with lignin skeleton and resin composition molded article

Applicants:

Fuji Electric Co., Ltd., Kawasaki, JP;

Mie University, Tsu, JP;

Inventors:

Tomoki Hasegawa, Hino, JP;

Masamitsu Funaoka, Tsu, JP;

Assignees:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

MIE UNIVERSITY, Tsu, JP;

Attorneys:

STAAS & HALSEY LLP

DAVID PITCHER

JOHN GARVEY

RICHARD GOLLHOFER

GENE GARNER

PAUL KRAVETZ

MARK HENRY

MEHDI SHEIKERZ

THOMAS L JONES

TEMNIT AFEWORK

SONNY CHOI

MICHAEL T LINES

ERIC W FARNSWORTH

GRADY J MCGINNITY

Primary Examiner:

Wenwen Cai

Int. Cl.
CPC ...
C08H 7/00 (2011.01); B29C 39/00 (2006.01); B29C 39/38 (2006.01); B29K 63/00 (2006.01); B29K 75/00 (2006.01); C07G 1/00 (2011.01); C08F 120/30 (2006.01); C08G 18/24 (2006.01); C08G 18/32 (2006.01); C08G 18/76 (2006.01); C08G 59/06 (2006.01); C08L 97/00 (2006.01); C22B 7/00 (2006.01);
U.S. Cl.
CPC ...
C08H 6/00 (2013.01); B29C 39/003 (2013.01); B29C 39/38 (2013.01); C07G 1/00 (2013.01); C08F 120/30 (2013.01); C08G 18/242 (2013.01); C08G 18/3215 (2013.01); C08G 18/7671 (2013.01); C08G 59/063 (2013.01); C08L 97/005 (2013.01); C22B 7/003 (2013.01); B29K 2063/00 (2013.01); B29K 2075/00 (2013.01); Y02P 10/20 (2015.11);
Abstract

A resin composition including a lignin skeleton capable of producing a heat-resistant molded article and being decomposed under relatively mild conditions. The resin composition contains a lignin skeleton including, as a base component, a phenolated lignin or a derivative thereof that contains a reactive monomer group, the phenolated lignin containing a phenol-containing monomer represented by the following general formula (I):

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Hasegawa, Tomoki. (2025). Resin composition with lignin skeleton and resin composition molded article (U.S. Patent No. 12305005). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12305005

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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