The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Nov. 07, 2023
Amcor Flexibles North America, Inc., Neenah, WI (US);
Michael D. Priscal, Neenah, WI (US);
Jacob A. Lasee, New London, WI (US);
AMCOR FLEXIBLES NORTH AMERICA, INC., Neenah, WI (US);
Abstract
Recyclable films having a first layer containing a polyethylene, a second layer containing a high-density polyethylene and a hydrocarbon resin, and a third layer containing a polyethylene may be used for thermoforming packaging components. Both the first and third layers have an overall density between about 0.92 g/cmand 0.97 g/cm. The film structure is advantageous as it can be more easily thermoformed than traditional high-density polyethylene films and can maintain the shape taken during thermoforming, exhibiting minimal warping or shrinking.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile