The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jan. 19, 2023
Seiko Epson Corporation, Tokyo, JP;
Taki Hashimoto, Nagano, JP;
Masayuki Gozu, Nagano, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A three-dimensional molding device includes: a molding unit including a nozzle configured to eject a molding material from a nozzle opening formed in a distal end portion; a stage having a deposition surface on which the molding material is deposited; a movement mechanism configured to change relative positions of the nozzle and the stage; a measurement unit configured to measure a distance between the deposition surface and the distal end portion; and a control unit configured to control the movement mechanism. The measurement unit includes a contact-type first detection unit configured to move in conjunction with the nozzle, and a contact-type second detection unit configured to move in conjunction with the stage. The first detection unit and the second detection unit are configured such that, when the first detection unit and the second detection unit come into contact with each other, one of the first detection unit and the second detection unit detects the contact.