The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Apr. 06, 2021
Applicant:
Nissei Asb Machine Co., Ltd., Nagano, JP;
Inventors:
Assignee:
NISSEI ASB MACHINE CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 49/22 (2006.01); B29C 45/16 (2006.01); B29C 49/06 (2006.01); B29C 49/42 (2006.01); B29K 23/00 (2006.01); B29K 67/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/22 (2013.01); B29C 45/16 (2013.01); B29C 49/06 (2013.01); B29C 49/42394 (2022.05); B29K 2023/12 (2013.01); B29K 2067/003 (2013.01); B29L 2031/7158 (2013.01);
Abstract
In a manufacturing method for a delamination method, in a second injection molding including forming a second layer on an inner peripheral side of a first layer of a preform having a bottomed cylindrical shape, a second resin material is guided from an opening portion formed in the first layer toward the inner peripheral side of the first layer, and a locking portion protruding from the opening portion toward an outer peripheral side of the first layer is integrally formed with the second layer.