The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Sep. 09, 2020
Applicant:
Hoya Corporation, Tokyo, JP;
Inventor:
Takeshi Aizawa, Tokyo, JP;
Assignee:
HOYA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/42 (2006.01); B29C 33/38 (2006.01); B29C 59/00 (2006.01); B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
B29C 33/424 (2013.01); B29C 33/3842 (2013.01); B29C 59/002 (2013.01); B29C 59/02 (2013.01);
Abstract
Provided are an imprint mold having a plurality of recesses constituting a predetermined mold pattern, in which the imprint mold comprises a stack, comprising a plurality of mold base material layers and an etching stopper layer interposed between the mold base material layers, on a substrate, the stack has the plurality of recesses having different depths, the mold base material layer and the etching stopper layer are made of materials having etching selectivity for each other, and each of the plurality of recesses has a bottom surface on which the etching stopper layer is exposed, and technology related thereto.