The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

May. 16, 2022
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Hiroaki Ota, Tokyo, JP;

Yosuke Ishihara, Tokyo, JP;

Daisuke Goto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 19/14 (2006.01); B22D 18/02 (2006.01); C22C 1/10 (2023.01); C22C 26/00 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
B22D 19/14 (2013.01); B22D 18/02 (2013.01); C22C 1/1073 (2023.01); C22C 26/00 (2013.01); H01L 21/4871 (2013.01); H01L 23/3733 (2013.01);
Abstract

A production method for an aluminum-diamond composite having a step of providing a laminate structure including a composition layer containing a diamond powder in an opening of a flat plate-like porous material having the opening so as to be separated from an inner circumferential surface of the opening and a step of press-fitting a melt of a metal containing aluminum into a space between the porous material and the laminate structure and impregnating the composition layer with the melt to form a composited part containing aluminum and diamond and forming metal layers on at least side surfaces of the laminate structure, in which the laminate structure includes a first mold release plate, a first inorganic layer, the composition layer, a second inorganic layer and a second mold release plate in this order.


Find Patent Forward Citations

Loading…