The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jul. 30, 2021
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Adarsh Basavalingappa, Penfield, NY (US);
Cristian Tivarus, Pittsford, NY (US);
Sungin Hwang, Pittsford, NY (US);
Yoshiaki Tashiro, Tokyo, JP;
Assignee:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H10F 30/225 (2025.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01);
U.S. Cl.
CPC ...
H10F 30/2255 (2025.01); H10F 39/199 (2025.01); H10F 39/803 (2025.01); H10F 39/8063 (2025.01); H10F 39/8067 (2025.01); H10F 39/807 (2025.01); H10F 39/811 (2025.01);
Abstract
A sensor chip including a resistor and a backside illuminated single photon avalanche diode (SPAD) that is connected to the resistor; and a sensor including a sensor chip with a resistor and a backside illuminated SPAD that is connected to the resistor. The backside illuminated SPAD including an anode, a cathode, and a multiplication structure.