The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Dec. 01, 2022
Applicant:

Bae Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);

Inventors:

Peter G. Schunemann, Hollis, NH (US);

Kevin T. Zawilski, Arlington, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C30B 17/00 (2006.01); C09D 5/00 (2006.01); C23C 16/30 (2006.01); C23C 16/52 (2006.01); C30B 29/42 (2006.01); C30B 29/60 (2006.01); C30B 35/00 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0005 (2013.01); C09D 5/006 (2013.01); C23C 16/306 (2013.01); C23C 16/52 (2013.01); C30B 17/00 (2013.01); C30B 29/42 (2013.01); C30B 29/602 (2013.01); C30B 35/002 (2013.01);
Abstract

GaAs IR window slabs having largest dimensions that are greater than 8 inches, and preferably greater than 12 inches, are grown using the Horizontal Gradient Freeze (HGF) method. Heat extraction is simplified by using a shallow horizontal boat that is only slightly deeper than the desired window thickness, thereby enabling growth of large slabs while also minimizing material waste and fabrication cost as compared to slicing and shaping thick plates from large, melt-grown boules. Single crystal seeds can be used to optimize the final orientation of the slabs and minimize secondary nucleation, thereby maximizing yield. A conductive doped GaAs layer can be applied to the IR window slab to provide EMI shielding. The temperature gradient during HGF can be between 1° C./cm and 3° C./cm, and the directional solidification can be at a rate of between 0.25 mm/h and 2.5 mm/h.


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