The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Jan. 12, 2024
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Do Yun Kim, Seoul, KR;

Seong Min Lee, Seoul, KR;

Eun Mi Kim, Seoul, KR;

Sang Ok Park, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); G02B 7/02 (2021.01); G03B 17/12 (2021.01); H04N 23/54 (2023.01); H04N 23/60 (2023.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); G02B 7/02 (2013.01); G03B 17/12 (2013.01); H04N 23/54 (2023.01); H04N 23/60 (2023.01); H05K 1/11 (2013.01);
Abstract

A lend moving apparatus includes a circuit board including a mounting groove, an image sensor arranged within the mounting groove of the circuit board, and a first epoxy arranged within the mounting groove. The mounting groove includes a first side surface and a second side surface that face each other, and a third side surface and a fourth side surface that face each other. The circuit board includes at least one application groove provided on the first side surface and/or the second side surface of the mounting groove. The at least one application groove includes an opening opened toward the upper surface of the circuit board. At least a portion of the first epoxy is arranged in the at least one application groove.


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