The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Aug. 31, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yeonkyung Chung, Suwon-si, KR;

Jichul Kim, Suwon-si, KR;

Jinyong Park, Suwon-si, KR;

Gyeongmin Jin, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H04M 1/0277 (2013.01); H05K 1/0204 (2013.01); H05K 1/111 (2013.01); H05K 3/3457 (2013.01);
Abstract

According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.


Find Patent Forward Citations

Loading…