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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12301744 B1

PDFFull Text
Date of Patent:
May. 13, 2025

Filed:

Sep. 06, 2022

Handheld electronic device

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

David A. Hurrell, San Mateo, CA (US);

Gregory N. Stephens, Morgan Hill, CA (US);

Isabel Yang, San Jose, CA (US);

John J. Baker, Santa Clara, CA (US);

Sherry Lee, San Jose, CA (US);

Matthew D. Hill, Mountain View, CA (US);

Obinna Onyemepu, Cupertino, CA (US);

Douglas G. Fournier, San Jose, CA (US);

Benjamin J. Pope, Woodside, CA (US);

Michael W. Firka, Santa Clara, CA (US);

Griffin L. Schmitt, San Francisco, CA (US);

Arun R. Varma, San Jose, CA (US);

Robert Hrabchak, Chicago, IL (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:

Brownstein Hyatt Farber Schreck, LLP

Primary Examiner:

Mukundbhai G Patel

Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); G06F 3/01 (2006.01); G06F 3/0488 (2022.01); G09G 3/18 (2006.01); H02K 33/02 (2006.01); H04M 1/02 (2006.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/90 (2023.01);
U.S. Cl.
CPC ...
H04M 1/0264 (2013.01); G06F 1/203 (2013.01); G06F 3/016 (2013.01); G06F 3/0488 (2013.01); G09G 3/18 (2013.01); H02K 33/02 (2013.01); H04M 1/0202 (2013.01); H04M 1/0262 (2013.01); H04M 1/0266 (2013.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/90 (2023.01); H05K 7/20481 (2013.01); H05K 7/205 (2013.01); H04M 2201/08 (2013.01); H04M 2201/38 (2013.01);
Abstract

A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.

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