The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Aug. 14, 2023
Applicant:

Sitime Coporation, Santa Clara, CA (US);

Inventors:

Paul M. Hagelin, Saratoga, CA (US);

Charles I. Grosjean, Los Gatos, CA (US);

Assignee:

SiTime Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/30 (2006.01); H02N 1/00 (2006.01); H03B 5/32 (2006.01); H03H 3/007 (2006.01); H03H 9/02 (2006.01); H03H 9/125 (2006.01); H03H 9/15 (2006.01); H03H 9/21 (2006.01); H03H 9/24 (2006.01); H10N 30/01 (2023.01); H10N 30/04 (2023.01);
U.S. Cl.
CPC ...
H03H 9/02448 (2013.01); H02N 1/00 (2013.01); H03B 5/30 (2013.01); H03B 5/32 (2013.01); H03H 3/0072 (2013.01); H03H 3/0073 (2013.01); H03H 3/0076 (2013.01); H03H 9/02244 (2013.01); H03H 9/02433 (2013.01); H03H 9/125 (2013.01); H03H 9/21 (2013.01); H03H 9/2405 (2013.01); H03H 9/2468 (2013.01); H03H 9/2484 (2013.01); H10N 30/01 (2023.02); H10N 30/04 (2023.02); H03H 2009/02251 (2013.01); H03H 2009/02283 (2013.01); H03H 2009/02291 (2013.01); H03H 2009/02299 (2013.01); H03H 2009/02322 (2013.01); H03H 2009/0233 (2013.01); H03H 2009/02496 (2013.01); H03H 2009/155 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/4902 (2015.01); Y10T 29/4908 (2015.01);
Abstract

A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.


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