The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Dec. 17, 2018
Applicant:

Melexis Bulgaria Ltd., Sofia, BG;

Inventor:

Dirk Leman, Lier, BE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H02K 11/33 (2016.01); H02K 29/08 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 29/08 (2013.01); H05K 1/0271 (2013.01); H05K 1/182 (2013.01); H05K 1/183 (2013.01); H05K 3/28 (2013.01); H05K 3/34 (2013.01); H05K 3/3426 (2013.01); H02K 2211/03 (2013.01); H05K 3/284 (2013.01); H05K 3/3405 (2013.01); H05K 3/3494 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10689 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/1572 (2013.01);
Abstract

An electronic device mountable in an electrical motor and a method for manufacturing an electronic device mountable in an electrical motor are provided. The electronic device includes a printed circuit board with a hole for mounting a semiconductor package which includes an integrated magnetic sensing device, the semiconductor package including leads and reinforcement material. The semiconductor package is mounted in the hole with the leads soldered to the printed circuit board. A gap is present between the semiconductor package and the printed circuit board. The reinforcement material is at least covering part of the leads and at least part of the printed circuit board.


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