The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Dec. 25, 2020
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Hiroyoshi Maesoba, Mie, JP;

Toshifumi Ichio, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/658 (2011.01); H01R 13/24 (2006.01); H01R 13/422 (2006.01); H01R 13/502 (2006.01); H01R 13/6582 (2011.01); H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6582 (2013.01); H01R 13/2407 (2013.01); H01R 13/4223 (2013.01); H01R 13/502 (2013.01); H01R 43/16 (2013.01);
Abstract

It is aimed to reduce friction resistance generated in a resilient contact portion. A shield connector is provided with a dielectric for accommodating an inner conductor, a tubular outer conductor for surrounding the dielectric, a resilient contact portion formed in the outer conductor, and a cut portion formed in the outer conductor and enabling a supporting portion supporting the resilient contact portion, out of the outer conductor, to be resiliently deformed. If the resilient contact portion contacts a mating outer conductor and is resiliently deformed, the supporting portion supporting the resilient contact portion is resiliently deformed by a reaction force from the mating outer conductor. Since a resilient deformation amount of the resilient contact portion is reduced by as much as the supporting portion is resiliently deformed, friction resistance generated in the resilient contact portion is reduced.


Find Patent Forward Citations

Loading…