The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Mar. 30, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sanghoon Park, Suwon-si, KR;

Kwanghyun Baek, Suwon-si, KR;

Juneseok Lee, Suwon-si, KR;

Dohyuk Ha, Suwon-si, KR;

Jungho Park, Suwon-si, KR;

Youngju Lee, Suwon-si, KR;

Jungyub Lee, Suwon-si, KR;

Jinsu Heo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/28 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/28 (2013.01); H01Q 1/2283 (2013.01);
Abstract

The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.


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