The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jul. 17, 2020
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Daisuke Yasuda, Tokyo, JP;
Takanori Yamashita, Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
A power storage device packaging material including a heat-sealable resin layer containing polypropylene and polyethylene, in which whitening and a decrease in the insulation properties due to molding are prevented. A laminate with at least a base material layer, a barrier layer, and a heat-sealable resin layer in this order from an outer side toward an inner side, wherein the heat-sealable resin layer contains polypropylene and polyethylene; a cross section of the heat-sealable resin layer in a thickness direction parallel to TD, a sea-island structure is observed in a cross-sectional image obtained with scanning electron microscope; the cross-sectional image is such that when the total thickness of a layer positioned closer to inner side than the barrier layer is taken as 100%, the cross-sectional image is obtained within a range of thicknesses of up to 12.5% from a surface opposite to the barrier layer side of the heat-sealable resin layer.