The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jan. 29, 2024
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Yuki Nakano, Kyoto, JP;
Assignee:
ROHM CO. LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 23/34 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/861 (2006.01); H01L 29/06 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 23/34 (2013.01); H01L 29/16 (2013.01); H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 29/861 (2013.01); H01L 29/8611 (2013.01); H01L 29/0692 (2013.01); H01L 29/2003 (2013.01);
Abstract
The semiconductor device of the present invention includes a semiconductor substrate, a switching element which is defined on the semiconductor substrate, and a temperature sense element which is provided on the surface of the semiconductor substrate independently from the switching element and characterized by being dependent on a temperature.